Market size, share and growth analysis across all major regions and key countries, with forecasts for 2022–2030. The competitive landscape profiles 13+ companies, including Dymax Corporation, DOW Chemical Company and Henkel AG & Co. KGaA.
The global PUR adhesive in electronics market was valued at USD 4.3 Bn in 2022 and is projected to reach USD 6.08 Bn by 2030, growing at a CAGR of 7.53%. Europe is the largest regional market and Asia-Pacific is growing fastest.
According to Custom Market Insights (CMI), The Global PUR Adhesive in Electronics Market size was estimated at USD 4.08 Billion in 2021 and is expected to reach USD 4.30 Billion in 2022 and is expected to hit around USD 6.08 Billion by 2030, poised to grow at a compound annual growth rate (CAGR) of 7.53 % from 2022 to 2030.
PUR adhesive in electronics provides a strong bond or adhesion during electronic assembly. Therefore, these adhesives are ideal components for electrical interconnects and thermal and structural bonding applications. In addition, PUR adhesive in electronics offers the reliability of electronics components. Furthermore, electronic adhesives are mainly used in surface-mounting, assembling substrates on PCBs and semiconductors, potting & encapsulations, and manufacturing & assembly of electronic circuits and products.
The global PUR adhesive in the electronics market is evolving, and companies are now focusing more on strengthening and consolidating R&D activities; thereby increasing the PUR Adhesive in Electronics production capacity thus, driving the market growth by catering to the need for PUR Adhesive in Electronics in various end-use industries.
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Growth Factors.
The growing use of PUR adhesive in electronics in the electronics market will aid the market growth.
The technological advancement, upgradation, and miniaturization in new product developments spurring electronics components and the OEM manufacturing industry have enhanced the performance of PUR adhesive in electronics during the forecast period. In response to this, the growing demand for touch screens, displays, medical electronics systems, automation of mobile devices, and medical devices are driving the PUR adhesive in the electronics market in the upcoming years. In addition, advancement in electronic components is also likely to act as one of the critical factors for the electronic adhesive market.
According to data published by Invest India in 2020, electronic Component production rose by $4 bn in 4 years from 2014 to 2018. These factors are expected to create new avenues for PUR Adhesive in Electronics.
The growth of the PUR adhesive in the electronics market is driven by growing demand for consumer wearable electronic devices, medical equipment, computers, PCB, laptop, LED, and many others that are expected to create the need for electronic adhesive. In addition, it is extensively used for potting, encapsulating, sealing, coating, and bonding. These factors are key market trends for PUR Adhesive in the Electronics market.
Furthermore, several key companies are actively engaged in manufacturing cost-effective PUR adhesive in electronics, where thermally and electrically based PUR adhesive in electronics are widely employed in the various end-use industry. These factors collectively witnessed high potential growth for PUR adhesive in electronics, thus, offering remunerative opportunities for the market.
PUR adhesive in electronics market segmentation.
PUR adhesive in the electronics market, segmented by Product Type
Depending upon the product type, the PUR adhesive in the electronics market is segmented into thermal conductive and electrically conductive.
The thermal conductive segment dominated the market in 2021 and is expected to grow over the forecast period and be valued at 1.39 billion in 2021.
The thermally conductive-based PUR adhesive in electronics is mainly formulated with silicone, epoxy, resins, and acrylic adhesives.
With upgradation in the thermal conductive properties, electronic adhesive finds application in chip-scale packaging, power semiconductors, PCBs, and other electronic devices. Additionally, electronic devices have successfully replaced traditional soldering systems. These factors are expected to boost the market in the upcoming years.
PUR adhesive in the electronics market, a segment based on the Application
Based on application, the global PUR adhesive in the electronics market is studied across surface-mount devices, potting & encapsulation, conformal coatings, industrial, and others. It is expected that the global surface-mount devices application segment to hold a dominant position during 2022 -2031 with a total share of 44.78%.
Growing demand for electric vehicles, consumer demand for electronic gadgets, electrically based household appliances, and government support for the electrical industry have escalated the electronic adhesive market during the forecast period. Additionally, electronic sticky acts as hardening agents mainly used to fix the component on the printed board.
Furthermore, the growing semiconductor industry has enhanced the demand for electronic adhesives. For instance, according to an article published by Semiconductor Industry Association in June 2022, Global Semiconductor Sales Increased by 13.3% in Q2 2022 Compared to Q2 2021. PUR adhesive in electronics has a wide range of applications in the semiconductor industry, where it has been used for surface-mounting and assembling substrates on PCBs and semiconductors. This factor is expected to drive the overall demand for PUR Adhesive in Electronics in the upcoming years.
Report Scope
| Feature of the Report | Details |
| Market Size in 2021 | USD 4.08 Billion |
| Projected Market Size in 2030 | USD 6.08 Billion |
| Market Size in 2022 | USD 4.30 Billion |
| CAGR Growth Rate | 7.53% CAGR |
| Base Year | 2023 |
| Forecast Period | 2024-2033 |
| Prominent Players | 3M, Dymax Corporation, DOW Chemical Company, Henkel AG & Co. KGaA, H.B. Fuller Company (Royal Adhesives & Sealants LLC), Evonik Industries AG, Sika AG, Bostik AG, ThreeBond, Shin Etsu Silicones, Konishi Co LTD., TERAOKA SEISAKUSHO CO. LTD., TOMOEGAWA, YAMATO Co. Ltd., and Others |
| Key Segment | By Product Type, Application, and Region |
| Report Coverage | Revenue Estimation and Forecast, Company Profile, Competitive Landscape, Growth Factors, and Recent Trends |
| Regional Scope | North America, Europe, Asia Pacific, Middle East & Africa, and South & Central America |
| Buying Options | Request tailored purchasing options to fulfill your requirements for research. |
Regional Analysis
Region-wise, the market is studied across North America, Europe, Asia-Pacific, and LAMEA.
Asia-Pacific is the dominant region in the PUR adhesive electronics market. This region is also anticipated to maintain its dominance throughout the forecast period, with a total market share of 40.78%. Countries such as China, India, Japan, South Korea, and others have a good presence in the electrical & electronics industry, which will create the need for PUR adhesive in electronics for surface mounting and encapsulation of semiconductor and PCB components. Furthermore, India has received FDI inflows of $ 88.94 bn in Computer Software and Hardware from April 2000 to June 2022. Government support for the electronics industry is expected to foster the market in the upcoming years.
In addition, countries such as Japan and Taiwan are constantly engaged in expanding their electrical & automation manufacturing output, where different types of PUR adhesive in electronics are widely employed as a protecting material in various electrical & electronic products. For instance, according to a report published by Hennessy Funds, Japan accounts for around 30% market for supplying factory automation products in the world. These factors are escalating the demand for PUR Adhesive in Electronics in the Asia-Pacific region.
Furthermore, the North American region also showed considerable growth during the forecast period. In addition, the Europe region is expected to show a positive change in the PUR adhesive in the electronics market during the forecast period. This is attributed to the rising population, growing demand for electric vehicles and electronic components, and another end-use industry that has surged the PUR Adhesive in the Electronics market.
Key Players
Key Insights:
Recent Development:
In January 2022: A Parker LORD, a subsidiary of Parker Hannifin, a global leader in motion and control technologies, has expanded its products portfolio for electric vehicle manufacturers that include new thermally conductive (TC) adhesives and one-component (1K) low-density gap fillers to support their leading product offering of thermal management encapsulants, bonds, and gap fillers. In addition, this strategic business expansion has increased the potential sales of Parker’s PUR Adhesive in Electronics in Germany.
In January 2022: DuPont launched a laminate adhesive product named Pyralux Adhesive System for High-Performance Electronics. This strategic product launch has enhanced DuPont’s product portfolio for PUR Adhesive in Electronics.
In June 2019: Bostik S A, has launched a new range of engineering adhesives named as Born2Bond, designed for ‘by-the-dot’ bonding applications in selected industries, such as automotive, electronics, luxury packaging, medical devices, and MRO. This strategic product launch has escalated Bostik’s product portfolio for adhesives.
COVID-19 Analysis
The PUR Adhesive in the Electronics market has had a negative impact due to the wake of the COVID-19 pandemic; owing to the rise in cases of COVID-19, implementation of emergency protocols and shutdown of various operations and facilities have been observed during 2020.
Due to the spread of the coronavirus pandemic, the manufacturer has faced challenges in terms of operation and supply chain of electronic-based products due to government restrictions during the lockdown.
Furthermore, to control the surge of novel coronavirus cases, there is a drastic shift of investments from other sectors toward the electronic industry. Also, several PUR adhesive-in electronics-based product manufacturing companies have shut down or shrunk their operations due to the risk of infection among the workforce.
This has temporarily hampered the demand and supply chain of PUR adhesive in electronics market. In addition, the falling income of customers has led contraction in demand for electronic components, displays, witches, automotive components, and others during the COVID-19 period.
In the first quarter of 2021, the market for PUR adhesive in electronics has experienced an increase in the demand for PUR Adhesive in Electronics in automotive, biomedical, electronics, textile, and other end-use industries worldwide, compared to that in 2020.
Segments covered in the report
By Product Type
By Application
On the basis of Geography
Updated: August 2026 · Formats: PDF, Excel, PPT
"Asia-Pacific" region will lead the global PUR Adhesive in Electronics market during the forecast period 2022 to 2030.
The key factors driving the market are cost effective, sustainable, and lightweight materials with low environmental impact in various applications industries.
The key players operating in the PUR Adhesive in Electronics market are 3M, Dymax Corporation, DOW Chemical Company, Henkel AG & Co. KGaA, H.B. Fuller Company (Royal Adhesives & Sealants LLC), Evonik Industries AG, Sika AG, Bostik AG, ThreeBond, Shin Etsu Silicones, Konishi Co LTD., TERAOKA SEISAKUSHO CO. LTD., TOMOEGAWA, YAMATO Co. Ltd.
The global PUR Adhesive in Electronics market is expanding growth with a CAGR of approximately 7.53 % during the forecast period (2022 to 2030).
The global PUR Adhesive in Electronics market size was valued at USD 4.08 Billion in 2021 and it is projected to reach around USD 6.08 Billion by 2030
Author · Sr. Research Analyst
Ayush Kadam is a Senior Market Research Analyst at Custom Market Insights, with over seven years of experience in syndicated and custom market research. He specializes in market sizing, competitive intelligence, industry trends, forecasting, and strategic insights, helping clients turn complex data into actionable business decisions.
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