US Semiconductor Bonding Market Size Likely to Grow at a CAGR of 5.55% By 2034

Market Size and Growth

The US Semiconductor Bonding Market size is forecast to grow at a CAGR of 5.55% from 2025 to 2034. The market is expected to reach USD 161.9 Million by 2034, up from USD 98.6 Million in 2025.

Overview

An expert in the field from CMI, an expert in industry trends, has expected continued growth in the US Semiconductor Bonding industry, due to the rapidly expanding telecom infrastructure and growing demand for wearable technology devices. The semiconductor bonding applies mechanical stability, electrical conductivity, and thermal management in the many wearable devices such as AI integrated devices, 5G-enabled devices, automotive, IoT, consumer electronics, and data centers. The growth of the market is driven by rising volume of waste across the U.S. and increasing supportive policies for Semiconductor Bonding.

Key Trends & Drivers

• Telecom Infrastructure: The telecom infrastructure has heavy reliance on the various devices such as optical transceivers, photonic integrated circuits (PICs), and high-bandwidth memory (HBM). These devices depend on wafer-level semiconductor bonding for achieving low latency, high speed, and reliable interconnects in compact footprints. Telecom OEMs such as Cisco, Qualcomm, Broadcom, and AT&T are investing in domestic packaging partnerships, further stimulating bonding demand within the U.S. supply chain.

• Rapidly expanding End Use Industries: The rapidly expanding use industries such as retail, healthcare, automotive, and agriculture are rapidly integrating IoT solutions, supported by the presence of major technology players in the U.S., thereby driving the U.S. internet of things (IoT) industry expansion in the coming years. This drives demand for advanced bonding technologies such as wafer-level bonding, flip-chip bonding, and hybrid bonding, which enable the miniaturization and high-density integration essential for IoT devices.

• Government and Industry Investments: The government and private stakeholders are increasingly investing in the U.S. semiconductor ecosystem. For instance, the US government’s CHIPS and Science Act, under which the US government has committed over USD 52 billion to boost domestic semiconductor manufacturing, research, and advanced packaging. Furthermore, recently Micron has announced the USD 30 Bn investment for building a second advanced memory fab in Boise, Idaho, expanding Manassas, Virginia, and also R&D. A lot of this is tied to onshoring DRAM, advanced packaging, etc. Thus, such increasing investment by government and private companies is expected to create huge opportunity for bonding material and packaging demand, especially for memory and high-bandwidth applications. Semiconductor Bonding is the most critical and essential step in the semiconductor packaging ecosystem, which enables the integration of advanced chips, heterogeneous systems, and high-performance modules these incentives directly fuel demand for bonding equipment, materials, and expertise.

Report Scope

SWOT Analysis

• Strengths: Rapid growth in advanced technologies such as AI, 5G, EVs, IoT, and high-performance computing devices is boosting the strong demand for various advanced semiconductor bonding methods such as hybrid and wafer-to-wafer bonding. Furthermore, supportive government policies, a strong R&D ecosystem, and growing strategic partnerships are expected to provide the strength to the semiconductor bonding market. For instance, the CHIPS and Science Act (2022) provides USD 52 billion in subsidies and tax incentives to boost domestic semiconductor production, directly driving bonding equipment demand for new fabs and advanced packaging facilities.

• Weaknesses: High technological cost, increasing dependency on the outside suppliers, overdependence on the global supply chains, and slow transition for legacy packaging are mainly restraining the market growth, thereby weakening the market momentum. High capital cost of the raw materials, machinery, and technology providers further weakens the market momentum. For instance, advanced bonding machinery and technology can cost tens of millions of dollars, limiting adoption by smaller players and raising barriers to entry.

• Opportunities: The rapid technological advancements in the semiconductor and bonding technologies are expected to create lucrative opportunities for the market during the forecast period. Various technological advancements, such as increasing demand for chiplet-based architectures, 3D ICs, and high-bandwidth memory (HBM), create opportunities for hybrid bonding and wafer-to-wafer bonding suppliers, which are expected to create lucrative opportunities for the market during the forecast period.

• Threats: The increasing geopolitical tensions coupled with trade restrictions are expected to create a threat for the market. The geopolitical tensions and trade restrictions, including export controls on China and Taiwan-related risks, could disrupt access to critical bonding materials and equipment components. The increasing global competition among Asian equipment makers to increase their strong foothold and potentially outcompete U.S. suppliers on cost and scale is expected to create a threat for the semiconductor bonding market.

List of the prominent players in the US Semiconductor Bonding Market:

• BE Semiconductor Industries N.V.
• ‌EV Group
• ‌Kulicke & Soffa Industries Inc.
• ‌Intel Corporation
• ‌Panasonic Corporation
• ‌ASMPT Semiconductor Solutions
• ‌MRSI Systems (Myronic AB)
• ‌WestBond Inc
• ‌Palomar Technologies
• ‌Dr. Tresky AG7
• ‌BE Semiconductor Industries NV7
• ‌Fasford Technology Co., Ltd. (Fuji Group)
• ‌Kulicke and Soffa Industries Inc
• Others

The US Semiconductor Bonding Market is segmented as follows:

By Type

• ‌Die Bonder
• ‌Wafer Bonder
• ‌Flip Chip Bonder

By Process Type

• ‌Die to Die Bonding
• ‌Die to Wafer Bonding
• ‌Wafer to Wafer Bonding

By Application

• ‌RF Devices
• ‌MEMS & Sensors
• ‌CMOS Image & Sensor
• ‌LED
• ‌3D NAND